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| Product Name: |
electronic potting compound silicone rubber
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| Supply Ability: |
10000t |
| Related proudcts |
silicone rubber, electronic potting c, |
| Specifications |
20kg/pail 20kg/pail and 200kg/pail 200kg/pail. |
| Price Term: |
FOB |
| Port of loading: |
Shenzhen |
| Minimum Order |
100 |
| Unit Price: |
8.65 |
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Typical Application of electronic potting compound silicone rubber: HY9055
electronic potting compound silicone rubber is suitable for bonded seal of electronic components, power module and control module, which requires waterproof and insulation. It can be broadly used for LED screen, Wind Power Generator, PCB substrate, etc. Silicone Rubber Electronic Material for good elasticity is a kind of low viscosity, Inherent flame resistance, two components addtion cured potting silicone with heat-conducting. It cures with both on room temperature and heated temperature. It has the feature of the higher temperature the faster of the curing time. It can be applied to electronic components for insulation, waterproofing, fixed and flame retardant. It mainly applied in electronic components surface with materials of PC(Poly-carbonate),PP,ABS,PVC, etc. and metal materials.
Description of electronic potting compound silicone rubber:
electronic potting compound silicone rubber is a newly insulating material
silicon of silicon compounds. It cures without heat, corrosion and just with little shrinkage.
It can be applied to the sealing and pouring of various electronic components, and then forming insulation system.
Features of electronic potting compound silicone rubber:
1. No toxicity, solventless, no odor and no cure by-product.
2. Equal amount of mixing ratio, good fluidity, easy processing.
3. No significant exotherm or shrinkage during curing.
Technical Parameters of electronic potting compound silicone rubber:
Before Curing Appearence Black/Tran***rent Fluid
Density(25°C g/ml) 0.98±0.02
Viscosisty(25°Ccps) Part A 500±100:Part B:800±100
Mixing Ratio A:B=1:1(By weight)
Operating Time(25°C hr) 5
Curing time(80°C hr) 0.5
After Curing Hardness(Shore A) 0-40
Dielectric Strength(KV/mm) 23
Volume Resistance(Ω.Cm) 1.0×10 15
Permittivity(1.2MHz) 3.0
Temperature Resist |
| Company: |
Hong Ye Jie Technology Co. Ltd.
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| Contact: |
Mr. Peter Yuan |
| Address: |
Pingdi |
| Postcode: |
518117 |
| Tel: |
86-755-89948294 |
| Fax: |
86-755-89948030 |
| E-mail: |
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